Abstract

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OPTIMIZATION OF VARIOUS PARAMETERS IN GOLD ELECTRODEPOSITION FOR MICROELECTRONICS

Vaishali Vaghela , Nisha K. Shah , V.V. Limaye


Electrochemical deposition is a method for obtaining metallic coating on surface by precisely controlling current and voltage over two electrodes in a plating bath. In the present research work, electrolyte Au has been deposited on Al alloy specimen by high speed cyanide based electroplating bath with Direct Current(DC) and Pulse Current(PC). This study reports the effects of deposition of gold on Al alloy with standard DC and PC mode. All the parameters affecting the electroplating bath like gold concentration, pH, temperature and current density are studied. It has been observed that the fine finishing of plating as well as fine grained structure of Al alloy specimen is obtained with PC as compared to DC. The sample is characterized by SEM to confirm the above morphology of surface. The replacement of DC by PC in the electrodeposition of gold has a remarkable effect in improving the mechanical properties of the deposits and in reducing their internal stresses. Deposit with finer grain is obtained with PC because current density is considerably higher as compared to DC which increases nucleation rate. PC is more effective in maintaining a uniform composition over the thickness of the deposit than DC plating. For many important applications in the electronic industries PC plating offers considerable advantages due to its remarkable effect.